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Diamond thickness reducing grinding wheel for silicon and sapphire wafer
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Product: Views:151Diamond thickness reducing grinding wheel for silicon and sapphire wafer 
Unit price: Negotiable
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Delivery date: Since the payment date Days delivery
Valid until: Long-term effective
Last updated: 2017-07-13 15:11
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Model Number: D255-#8651 Brand Name: XINYA Key Specifications/Special Features: Ceramicdiamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone waferand sapphire wafer.For reducing the thickness of thesiliconwaferand sapphire wafer.
Shipping Information:
  • FOB Port: Shanghai
  • Lead Time: 10 - 15 days
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe
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